Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by Ephraim Suhir
MathematicsWhat Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by Ephraim Suhir is worth on the used-book market.
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Item details
- UPC / EAN
- 113862473X
- Brand
- Ephraim Suhir
- Author
- Ephraim Suhir
- Published
- 2020
- Publisher
- CRC Press
- Pages
- 344
- ISBN
- 113862473X
- Editions
- 6
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices resale value
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices by Ephraim Suhir (2020). Across 6 editions. Used-book value depends heavily on edition (first printing vs. reprint), condition, dust jacket, and whether it's signed. First editions and out-of-print titles command the biggest premiums.
What drives the price
First editions/first printings, intact dust jackets, signatures, and unmarked pages are the top value drivers. Book-club editions and later reprints are worth far less.
Frequently asked questions
- Is this 2020 mathematics text still relevant for modern electronics?
- Yes, the principles in "Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices" remain highly relevant in electronics engineering.
- What is the ISBN for this specific edition?
- The ISBN for this book is 113862473X.
- How many editions of this work are available?
- This publication is listed as having 6 editions.